The Yokogawa NFCP502-W05 S1, also cataloged as the NFCP502 CPU Module, operates as a dedicated hardware component for high-performance real-time process control within CENTUM VP and ProSafe-RS platforms. The chassis-mounted sub-assembly executes complex control logic and coordinates high-speed deterministic processing natively at the hardware tier to maintain operational continuity across distributed automation systems.
Hardware Specifications
Parameter
Specification
Model
NFCP502-W05 S1
Brand
Yokogawa
Origin
Japan
Weight
0.35 kg
Dimensions
130 mm x 28 mm x 130 mm
Operating Temp
0 to 55 deg C standard band / -20 to 70 deg C extended option
Protection Rating
IP21 enclosure rating with structural EMI/RFI shielding
Processor
32-bit RISC CPU, dual-core, greater than or equal to 800 MHz (Atom E3815 variant: 1.46 GHz)
Main Memory
256 MB RAM with ECC protection
Static RAM
2 MB with ECC, battery-backed
Secondary Memory
1 GB on-board Flash, 1 x SD card slot (SDHC, 4-32 GB, Class 10)
Ethernet Ports
4 x RJ45, 10/100/1000 Mbps, redundant configuration supported
Serial Port
1 x RS-232-C (D-sub 9 pins, male)
I/O Interface
SB bus, supports duplex/redundant I/O lines up to 128 modules
Redundancy Configuration
Hardware-tier CPU, power, and communication redundancy
Fault Switchover Time
Less than or equal to 50 ms execution window
Supply Voltage
5 VDC +/-5%
Current Consumption
Max. 1700 mA
Supported Protocols
Vnet/IP, Modbus, secure industrial protocols
Product Type
CPU Processors
Process Control & DCS Instrumentation Interface
4-20 mA HART Loop Protocol System Integration The controller substrate coordinates real-time data transfer blocks with downstream analog modules interfacing with 4-20 mA HART loop protocol field instrumentation drops. The processor evaluations enable the pass-through of secondary device variables directly to upper-tier asset management databases without extending local control network latency parameters.
Channel-to-Channel Isolation Control The architecture incorporates distinct optical and galvanic isolation boundaries between the high-speed processing core and the distributed I/O backplane bus. This design contains localized electrical transients and common-mode line noise on peripheral nodes, maintaining channel-to-channel isolation parameters across up to 128 expansion digital, analog, or pulse modules.
