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The GE Fanuc VMIVME-5576 332-015576-010, also cataloged as the VMIVME-5576 Reflective Memory Interface, operates as a dedicated hardware component for high-speed VME-to-VME network data replication within real-time synchronized platforms. Configured as a single 6U VMEbus board, this card mirrors data spaces across distributed processing nodes natively at the hardware tier via fiber-optic links. It updates localized memory arrays parallel to master processor bus execution cycles.
| Parameter | Specification |
|---|---|
| Model | VMIVME-5576 332-015576-010 |
| Brand | GE Fanuc / VMIC |
| Origin | United States |
| Weight | 1.10 lbs |
| Form Factor | Single 6U VMEbus board profile |
| Network Interface | High-speed fiber-optic serial ring |
| Serial Connection Speed | 170 Mbaud serial network velocity |
| Data Transfer Rate (Standard) | Up to 6.2 Mbyte/s throughput without redundant transfer |
| Data Transfer Rate (Redundant) | Up to 3.2 Mbyte/s throughput with redundant transfer active |
| Onboard Memory | 256 Kbyte to 1 Mbyte of high-speed SRAM |
| Memory Access Decoding | A32, A24, D32, D16 VMEbus configurations |
| Network Capacity | Supports up to 256 independent nodes |
| Maximum Node Distance | Up to 2000 meters transmission boundary between nodes |
| Interrupt Capabilities | Inter-node interrupt routing to any or all network nodes |
| Error Suppression | Built-in hardware-tier redundant transmission mode |
Q: What specific hardware behaviors manifest if a fiber-optic cable breaks between two VMIVME-5576 nodes?
A: The physical-layer receiver immediately detects a loss of signal, updates the board's internal status register, and illuminates the front-panel error indicator. Data updates continue to write into the local SRAM array via the VMEbus, but network broadcast cycles freeze at the broken node until the fiber loop is physically restored or rerouted.
Q: Can this 6U VMEbus board be pulled out of the subrack while the backplane power remains active?
A: No. Standard VMEbus specifications do not provide staging pins or isolation layers to handle live hot-swapping. Extracting this card under power can create transient voltage arcs on the backplane data lines, risking permanent damage to the onboard SRAM chips and halting parallel execution processes on neighboring cards.

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