Configured for 24 VDC field‑power distribution and shield termination within Mark VIe I/O assemblies, the GE IS200JGPAG1A, also cataloged as the IS200JGPAG1A ground and power board, provides direct physical/electrical execution. It delivers regulated excitation power for 4–20 mA field instruments and establishes a structured grounding path adjacent to PCAA and TCAT analog modules.
Hardware Specifications
Parameter
Specification
Model
IS200JGPAG1A
Brand
GE
Origin
United States
Weight
Not specified
Dimensions
33 cm high x 3.2 cm wide
Operating Temp
-30 to 65 deg C
Power Consumption
Supplied via 28 VDC feed from PCAA/TCAT
Core Performance
Regulated 24 VDC distribution and shield termination
Technology
Through hole
Product Type
Ground and Power Board
Backplane Bus Communication Velocity and I/O Density Scaling
Within Mark VIe architectures, the board maintains deterministic backplane bus communication velocity by providing stable excitation power without introducing timing skew into analog acquisition cycles. I/O density scaling is preserved through twelve independent regulators, preventing cross‑impact between powered transmitters. Firmware flash compatibility resides entirely at the PCAA/TCAT module level; the JGPA board operates as fixed hardware with no programmable logic.
Frequently Asked Questions
Q: Can the IS200JGPAG1A be removed while the panel is energized? A: Removal under power is not recommended. Disconnecting the board may interrupt excitation power and cause analog channel faults.
Q: Does each 24 VDC output channel have isolation? A: Yes. Each channel is independently regulated to prevent cross‑impact between field devices.
Q: How does the board differentiate power terminals from shield terminals? A: TB3 uses orange terminals for 24 VDC outputs, while TB1 and TB2 use green terminals for shield termination.
Field Installation Guidelines
Mount the board adjacent to PCAA or TCAT modules to minimize cable length and reduce noise pickup.
Ensure correct orientation of the P1 cable supplying 28 VDC from the analog module.
Maintain separation between shield wiring and power conductors to reduce induced noise.
For conductive mounting, ensure metal‑to‑metal contact for direct grounding.
For isolated mounting, use non‑conductive hardware and route shield grounds to the designated grounding point.
Verify terminal torque and labeling before energizing the system.
