GE IS200ACLEH1CAA Application Control Layer Module
The GE IS200ACLEH1CAA, also cataloged as the IS200ACLEH1CAA safety I/O pack, serves as the primary application‑layer controller used to execute Ethernet and ISBus communication, 125 V dc input handling, and regulated 24 V dc output distribution across Mark VI platforms. It occupies two half‑slots in Innovation Series or EX2100 racks and provides fixed routing for processor‑level control functions.
Hardware Specifications
Parameter
Specification
Model
IS200ACLEH1CAA
Brand
GE
Origin
United States
Weight
Not specified
Dimensions
23.495 cm × 10.795 cm
Operating Temp
-30 to 65 deg C
Power Consumption
Not specified
Core Performance Indicators
125 V dc input; regulated 24 V dc output; 100 MHz processor; PCI controller; 128 K level‑2 cache; 8 MB DRAM; 4 MB flash BIOS; Ethernet ports; ISBus ports; COM1/COM2 serial ports; DIN‑rail mounting; non‑volatile memory; Toolbox interface
Profinet / EtherNet/IP Deterministic Networks
Within Mark VI architectures, the ACLE module aligns with deterministic I/O‑pack timing required for synchronous turbine‑control execution. Its processor, PCI controller, and fixed signal‑conditioning paths maintain predictable propagation intervals for Ethernet and ISBus communication. I/O density scaling is achieved through standardized pack mounting, while firmware flash compatibility resides entirely at the controller level; ACLE hardware characteristics remain fixed across all variants.
Frequently Asked Questions
Q: How does the BIOS support system initialization? A: The BIOS identifies hardware, directs boot‑sequence output to COM1, supports RS‑232C operating‑system loading, and initializes GE‑specific hardware.
Q: Can the IS200ACLEH1CAA be replaced while energized? A: No. The module must be removed only when the associated Mark VI segment is de‑energized to avoid transient loading on the 125 V dc input and 24 V dc output rails.
Q: Where is the module mounted? A: It mounts in Innovation Series drive racks or EX2100 exciter racks, occupying two half‑slots and interfacing through CABP or EBKP backplanes.
Field Installation Guidelines
Maintain separation between 125 V dc input wiring and low‑voltage 24 V dc output lines to reduce noise coupling.
Ensure DIN‑rail bonding is secure and free of paint or oxidation to maintain grounding continuity.
Verify connector seating before energizing the rack to ensure deterministic controller communication.
Bond shielded cables at a single termination point to avoid ground‑loop formation.
Maintain adequate airflow around the module to support convection cooling.
