Configured for multi-channel process variable execution in Yokogawa Field-it I/O (FIO) platforms, the Yokogawa SARM55D (SARM55D Relay Board for FIO) provides direct physical/electrical execution. The solid-state hardware node conditions and routes binary discrete parameters directly at the hardware tier to update centralized register states across the system fieldbus infrastructure.
Hardware Specifications
Parameter
Specification
Model
SARM55D
Brand
Yokogawa
Origin
Japan
Weight
2 kg (4.41 lbs) gross package mass
Dimensions
Standard FIO rack interface board dimensions
Operating Temp
Standard industrial processing ambient limits
Power Consumption
Base logical draw from connected FIO bus architecture
Module Type
Relay Board for FIO
Field Interface
Built-in electromechanical relay contact array
System Integration
Pairs with standard Yokogawa FIO modules
Isolation Boundary
Galvanic isolation between system logic and field contacts
Product Type
Digital I/O Cards
Process Control & DCS Instrumentation Rails
FIO Platform Interfacing and Deterministic Bus Communication The relay board communicates directly with the Field-it I/O subsystem backplane, handling high-density binary control parameters natively at the hardware tier. The internal circuit components convert low-power system logic commands into physical contact transitions, allowing master controllers to execute interlock states and switch external field elements without introducing processing delays into active process control structures.
4-20 mA HART Loop Protocol Isolation and Suppression Rails While designed strictly for high-reliability discrete switching tasks, the board operates within shared enclosures alongside instrument trunks running the 4-20 mA HART loop protocol. Built-in galvanic isolation barriers and noise suppression elements contain inductive inductive feedback and high-voltage transients from field-side components, preventing common-mode voltage offsets from distorting adjacent low-level analog measurement paths.
