The Schneider Electric TSXDSZ08R5 is a high-reliability relay output module designed for use within the Modicon TSX Micro programmable controller architecture. This unit provides eight independent, galvanically isolated relay contacts, facilitating the control of diverse field devices across varying voltage levels. By utilizing electromechanical relay switching, the module enables seamless integration between low-voltage PLC logic and higher-voltage AC or DC field loads, making it an essential component for industrial automation, process control, and machinery management.
Features
Eight (8) independent, normally open (NO) mechanical relay outputs.
Galvanic isolation between field circuits and the internal controller backplane.
Integrated RC suppression networks to mitigate inductive spikes during load switching.
Front-panel LED indicators for real-time verification of individual relay states.
Removable screw terminal blocks for simplified field wiring and rapid maintenance.
Designed for robust performance in demanding industrial environments.
Applications
The TSXDSZ08R5 is widely utilized in industrial environments requiring flexible, isolated switching, including:
Thermal power plant boiler controls.
Fluid management and pumping stations.
Automated manufacturing and mineral extraction machinery.
Interface applications where logic-level signals must drive high-voltage actuators or contactors.
Technical Specifications
Model
TSXDSZ08R5
Brand
Schneider Electric
Number of Outputs
8 Normally Open (NO)
Operating Voltage
24-240 VAC / 24-48 VDC
Max Current per Channel
2.0 A
Total Module Current
10.0 A
Min Switching Current
1 mA at 5 VDC
Internal Power Consumption
45 mA (5 VDC) / 60 mA (24 VDC)
Insulation Voltage
2000 VAC (Contacts to Bus)
Operating Temperature
0 to 60 deg C
Storage Temperature
-25 to 70 deg C
Humidity
10% to 95% non-condensing
Installation Guidelines
Ensure the system power is completely disconnected before installing or removing the module from the TSX Micro rack.
Verify that the module is firmly seated and locked into the chassis connector to ensure proper backplane communication.
Maintain proper spacing for ventilation to ensure the module operates within its specified temperature range.
Use shielded cabling for field wiring where necessary to minimize electromagnetic interference (EMI) in high-noise environments.
Ensure that total current draw across all channels does not exceed the module's 10 A limit to prevent thermal damage.
Handle with standard ESD precautions to prevent damage to internal PCB components.
