GE IS200ACLEH1ACB(IS215ACLEH1A) Application Control Module

The General Electric IS200ACLEH1ACB, also cataloged as the IS200ACLEH1ACB Application Control Layer Module (alternate part number IS215ACLEH1A), operates as a dedicated hardware component for executing application-level logic and managing system diagnostics within Mark VIe control platform architectures.

Suffix Breakdown & Model Matrix

The model IS200ACLEH1ACB (alternatively designated as IS215ACLEH1A) belongs to the General Electric Mark VIe control platform. Based on standard part number configuration rules, the base designation identifies the Application Control Layer (ACLE) module form factor, while the specific suffix string encodes the internal processor revision level, memory capacity, and hardware assembly matrix.

Hardware Specifications

Backplane Bus Communication Velocity & Network Interfaces

The module integrates high-speed processors, memory resources, and Ethernet interfaces to support distributed control architectures and real-time communication between control and protection layers. Configurable firmware flash compatibility and backplane bus communication velocity ensure deterministic data transfer across the Mark VIe control infrastructure. Software configuration and continuous system diagnostics are fully supported via the ToolboxST engineering environment.

Frequently Asked Questions

Q: Does the application control layer module support hot-swap replacement under live system power?

A: No, system power and backplane supplies must be completely de-energized prior to extracting or inserting the General Electric IS200ACLEH1ACB module to prevent electrical faults and bus communication errors.

Q: How is the module configured and monitored during operation?

A: Configuration, logic execution management, and real-time diagnostics are executed through software tools such as ToolboxST connected via the integrated Ethernet interfaces.

Field Installation Guidelines

Mount the printed circuit board module securely within the designated Mark VIe rack enclosure, adhering to the 280 mm × 120 mm × 22 mm physical dimensions to ensure proper backplane engagement. Route Ethernet communication cables away from high-voltage power lines to minimize electromagnetic interference. Verify that operating temperatures remain within the -30 deg C to +65 deg C range and inspect all grounding paths prior to system energization.