Schneider TSXMAP1074 Mapway Module

Product Description

The Schneider TSXMAP1074 Mapway Module is a communication interface designed for the Modicon Premium automation platform. It provides reliable connectivity and expansion capabilities, enabling seamless integration of distributed I/O and control modules. Built for industrial automation systems, this module ensures efficient data exchange and robust performance in demanding environments.

Main Features

• Product Range: Modicon Premium automation platform

• Component Type: Mapway communication module

• Application: Expansion and communication interface for distributed I/O

• Connectivity: Supports Mapway bus architecture for modular system integration

• Compatibility: Designed for Modicon Premium PLCs and associated modules

• Diagnostics: Integrated LED indicators for module status and communication activity

• Installation: DIN rail or rack-mounted format for easy integration

Environmental Ratings

• Operating Temperature: 0…60 °C

• Storage Temperature: -25…70 °C

• Humidity: 5–95 % non-condensing

• Altitude: 0–2000 m

Physical Characteristics

• Format: Standard module size for Modicon Premium racks

• Weight: Compact and lightweight for modular installation

• Protection: IP20, pollution degree 2