IS200VAICH1DAA | General Electric | Analog Input/Output Board

Description

The GE IS200VAICH1DAA, also cataloged as the IS200VAICH1D analog I/O board, serves as a dedicated module for processing 4‑20 mA analog inputs and driving analog outputs within the Mark VI control platform. The board supports simplex and TMR architectures, routing all field signals through its terminal‑board interfaces and VME‑rack connectors for deterministic acquisition and output execution.

Suffix Breakdown & Model Matrix

• The IS200VAICH1DAA identifier does not include decomposable suffix elements.

• No variant matrix is defined in the provided documentation.

• The part number is treated as a fixed Mark VI VAIC hardware designation.

Hardware Specifications

• Part Number: IS200VAICH1DAA

• Brand: GE

• Series: Mark VI

• Product Type: Analog Input/Output Board

• Country of Manufacture: United States

• Number of Channels: 24

• Input Span: 4‑20 mA

• Power Consumption: Less than 31 mW (per documentation)

• Technology: Surface‑mount PCB

• Operating Temperature: -30 deg C to +65 deg C

• Availability: In stock

Triple Modular Redundancy (TMR) Architecture

• Input signals from the terminal board are fanned out to three VME racks labeled R, S, and T.

• Each rack hosts an independent VAIC instance, allowing three parallel acquisition paths.

• Output currents are driven through a coordinated circuit that blends contributions from all three VAICs.

• If one VAIC fails, it is automatically removed from the output circuit while the remaining two continue operation.

• This architecture maintains output accuracy and system continuity during hardware faults.

Simplex Architecture

• A single VAIC receives all terminal‑board inputs and generates all output currents.

• Suitable for applications where redundancy is not required.

• Simplifies wiring, commissioning, and maintenance.

• Maintains full analog acquisition and output capability without triplex coordination.

Installation Guidelines

• Cable connections to TBAI terminal boards are made through J3 and J4 connectors on the lower portion of the VME rack.

• J3 and J4 are latching‑type connectors designed to prevent accidental disconnection.

• Ensure cables are fully latched to maintain stable analog signal transfer.

• After completing all connections, power up the VME rack to initialize the VAIC and terminal boards.

• Maintain ESD protection during handling to avoid damage to surface‑mount components.

• Verify correct terminal‑board orientation and wiring before energizing the system.

Frequently Asked Questions (FAQ)

• Q: Can the IS200VAICH1DAA be inserted or removed under power? A: No. The VME rack must be powered down before installing or removing the VAIC to avoid backplane damage.

• Q: Does the VAIC automatically manage TMR failover? A: Yes. Faulted VAIC modules are isolated from the output circuit, allowing the remaining modules to maintain correct output current.

• Q: Are the 4‑20 mA channels isolated? A: Isolation is provided through the terminal‑board and VAIC design, but channel‑to‑channel isolation levels depend on the specific TBAI board used.

Field Installation Guidelines

• Maintain shield bonding at a single grounding point to prevent noise coupling into 4‑20 mA circuits.

• Route analog cables separately from high‑voltage wiring to minimize induced interference.

• Confirm latch engagement on J3 and J4 connectors before powering the rack.

• Allow adequate airflow around the VAIC to avoid thermal buildup in dense VME enclosures.

• Verify terminal‑board jumpers and configuration settings match the intended simplex or TMR application.