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Configured for turbine‑temperature acquisition within the Mark VIe platform, the GE IS200TBTCH1CBB, also cataloged as the TBTCH1C thermocouple terminal board, provides 24‑channel thermocouple interfacing through barrier‑type terminal blocks and DC‑type backplane connectors. The board supports multiple thermocouple types and integrates cold‑junction reference devices for stable measurement accuracy.
The IS200TBTCH1CBB identifier does not define decomposable suffix elements.
No variant matrix is available in the provided documentation.
The part number is treated as a fixed Mark VIe TBTC hardware designation.
Part Number: IS200TBTCH1CBB
Brand: GE
Series: Mark VIe
Product Type: Thermocouple Input Terminal Board
Channels: 24 thermocouple channels
Supported Types: E, J, K, S, T
Span: -8 mV to +45 mV
Operating Temperature: 0 to +45°C
Size: 15.9 cm high × 17.8 cm
Availability: In stock
Country of Origin: United States
Manual Reference: GEH‑6421M
Supports grounded and ungrounded thermocouples up to 300 m from the turbine control panel.
Maximum allowable two‑way cable resistance: 450 ohms.
Includes high‑frequency noise suppression and dual cold‑junction reference devices for stable measurement.
Interfaces with PTCC I/O packs through DC‑type connectors:
TBTCH1C (Simplex): two DC connectors, supports two PTCC packs for full 24‑channel acquisition.
TBTCH1B (TMR): six DC connectors, supports one to three PTCC packs, providing 12‑channel capability.
Supports simplex, dual, and TMR Mark VIe configurations.
Q: Can the TBTCH1CBB support mixed thermocouple types simultaneously? A: Yes. Each channel is independent and supports any of the listed thermocouple types.
Q: Does the board provide its own cold‑junction compensation? A: Yes. Two onboard cold‑junction reference devices provide compensation for all channels.
Q: Are long‑distance thermocouple runs supported? A: Yes. Up to 300 meters, provided cable resistance does not exceed 450 ohms.
Use the two removable barrier‑type terminal blocks for thermocouple wiring; each block supports #12 AWG conductors.
Ensure shield terminals are bonded to chassis ground to minimize noise.
Verify DC‑type connector seating before powering the system.
Route thermocouple wiring away from high‑voltage conductors to avoid induced noise.
Confirm PTCC pack quantity and connector alignment based on simplex or TMR configuration.
Inspect cold‑junction devices for proper placement and thermal contact.

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