General Electric IS200TRLYH1BGF Relay Output Board

General Electric IS200TRLYH1BGF Mark VI Series Relay Output Board

Configured for relay output execution in Mark VI platforms, the General Electric IS200TRLYH1BGF (IS200TRLYH Relay Output Board) provides direct physical/electrical execution.

Hardware Specifications

Backplane Bus Communication Velocity and System Architecture

The IS200TRLYH1BGF interfaces directly with VME rack I/O boards (VCCC, VCRC, or VGEN) via dedicated cables with molded plugs, matching the specific backplane bus communication velocity and deterministic synchronization requirements of the Mark VI Speedtronic platform. In simplex configurations, control signals and feedback monitoring are routed exclusively through the JA1 connector. For triple modular redundancy (TMR) architectures, deterministic voting and multi-channel synchronization are maintained by distributing command paths across connectors JR1, JS1, and JT1. This architecture ensures synchronized frame-rate relay driving across redundant hardware layers.

Frequently Asked Questions

Q: How are control signals and feedback voltages transmitted in simplex operation?

A: In simplex operation, D-type connectors facilitate the transmission of control signals and monitor feedback voltages between the I/O processors and the TRLY board via connector JA1.

Q: What are the electrical isolation constraints for the onboard relays?

A: The onboard magnetic relays feature a rated contact-to-contact isolation voltage of 500 VAC for one minute, and a coil-to-contact isolation voltage of 1,500 VAC for one minute.

Q: How are power distribution and overcurrent protection configured on the board?

A: The board accepts 125 VDC, 115/230 VAC, or an optional 24 VDC source. Power distribution is managed via individual jumper-selectable fuses and onboard surge suppression networks to isolate faults.

Field Installation Guidelines

• Wiring and Cable Connections: Ensure all cables with molded plugs are fully seated into their respective D-type connectors (JA1 for simplex; JR1, JS1, and JT1 for TMR systems) and that the mechanical retaining screws are secured to prevent intermittent contact.
• Jumper Configuration: Prior to powering the unit, manually verify all jumper settings for the first six relay circuits to match the field device specifications (dry Form-C contacts or powered external solenoid configuration). Ensure fuse-selection jumpers match the deployed source voltage (125 VDC, 115/230 VAC, or 24 VDC).
• Shield Grounding and Routing: Maintain proper separation between high-voltage AC/DC relay output lines and low-voltage VME control signaling cables. Field wiring shields must be terminated at the designated chassis ground bus bar to suppress electromagnetic interference (EMI).
• Thermal Management: Install the board vertically within the Mark VI enclosure to ensure unobstructed convective airflow across the relays and onboard suppression components, maintaining ambient operational conditions within the specified 0 to 60 deg C window.