General Electric DS200LDCCH1ALA Drive Control/LAN Communications Board

Configured for turbine and drive control management in Mark V Speedtronic systems, the General Electric DS200LDCCH1ALA (DS200LDCC Drive Control Board) provides direct physical execution of multi-processor control logic and network communication within automated drive assemblies, including compatibility with DIRECTO-MATIC 2000 drives.

Suffix Breakdown & Model Matrix

Hardware Specifications

Industrial Control & Drive Characteristics

• Backplane bus communication velocity: The board integrates four microprocessors (DCP, MCP, CMP, and LCP) to manage high-speed, deterministic data flow across the backplane, supporting specific requirements for DIRECTO-MATIC 2000 drive systems.
• Profinet / EtherNet/IP deterministic networks: The LAN control processor enables synchronized communication within the Mark V architecture, maintaining the timing required for protocol bus integration (DLAN+, C-Bus, or Genius).
• I/O density scaling: The PCB supports complex feedback loops required for gas, steam, and wind turbine drive regulation, with optional support for the DS200ADCI terminal board for extended interface connectivity.
• Firmware flash compatibility: The board architecture ensures operational consistency across various turbine control software versions, maintaining legacy compatibility with patented Speedtronic control logic.

Frequently Asked Questions

Q: What bus systems are supported by the DS200LDCCH1ALA?

A: The board supports DLAN+ LAN, DLAN (early/smaller drives), Genius Interface Bus, CPL Interface Serial Link, and C-Bus Differential Bus systems.

Q: Is an auxiliary terminal board required for certain bus configurations?

A: Yes. Integration with Genius, CPL, or C-Bus systems requires the installation of an optional DS200ADCI terminal board.

Field Installation Guidelines

• Mounting: Secure the board in the control cabinet using the provided mounting holes. Handle the PCB only while utilizing ESD-safe procedures and static-resistant packaging to protect sensitive microprocessor components.
• Grounding: Bond the board chassis to the system common ground bus. A low-impedance connection is mandatory to ensure the stability of the bus communication and I/O signal paths.
• Wiring: Ensure correct cable termination for the selected bus protocol. Segregate communication cabling from high-voltage field wiring to prevent inductive interference with the LAN control processor circuitry. Verify all connections against the series manual before applying system power.