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Configured for high-density discrete signal processing, electronic load modulation, and smart instrumentation tracking, the GE IC660BBD024 (IC660BBD024 Source I/O Block) provides direct physical/electrical execution. The distributed subsystem interfaces 2-wire and 3-wire DC sensors natively at the hardware tier to route binary channel data across localized token-passing serial fieldbus networks.
| Parameter | Specification |
|---|---|
| Model | IC660BBD024 |
| Brand | General Electric (GE) |
| Series | Genius I/O / Series 90-30 and 90-70 Subsystems |
| Origin | United States of America (USA) |
| Weight | 4 lbs (1.81 kg) |
| Dimensions | 22.44 cm x 9.05 cm x 11.23 cm |
| Nominal Operating Voltage | 12/24 VDC single-source line |
| Operating Voltage Range | 10 to 30 VDC continuous input envelope |
| Required Internal DC Power | 150 mA typical / 300 mA maximum continuous load |
| Power Supply Dropout Tolerance | 4 ms at 12 VDC / 20 ms at 24 VDC |
| Channel Density | 32 discrete points (individually configurable) |
| Circuit Configuration | Input, output, or output with feedback modes (Sourcing logic) |
| Steady-State Output Current | 0.5 A maximum per circuit |
| Maximum Output Inrush Current | 4 A up to 10 ms (maximum frequency once every 0.5 sec) |
| Aggregate Block Output Current | 16 A maximum simultaneous threshold |
| Input Impedance | 3.3 k Ohms typical |
| Input Processing Latency | 1.4 ms base plus programmable filter delay configuration |
| Selectable Input Filter Times | 1, 2, 3, 4, 5, 10, 20, 30, 40, 50, 60, 70, 80, 90, or 100 ms |
| Block-to-Block Isolation | 850 V galvanic isolation barrier |
| Operating Temperature Range | 0 to +60 deg C (+32 to +140 deg F) |
| Relative Humidity Limits | 5% to 95% RH, non-condensing |
| Product Type | Distributed I/O Modules |
Q: What programmatic or electrical faults manifest if an output wiring error creates a shorted electrical load?
A: The module's internal self-protecting solid-state switches detect the overcurrent state and latch off the faulted channel driver instantly. The block concurrently sets a "Switch Fault" error flag, generates an explicit diagnostic data package across the fieldbus link, and turns off the corresponding individual logic-side LED.
Q: Can the internal electronics module assembly be replaced while the field wire terminations remain connected?
A: Yes, the mechanical footprint consists of a separate terminal base (IC660TBD024) and a plug-in electronics module (IC660EBD024). This structural split allows online extraction and insertion of the electronic component board without disturbing field terminations or requiring system re-parameterization.

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