Emerson VE5135 DeltaV System Power Supply

The Emerson VE5135, also cataloged as the VE5135 System Power Supply, serves as a modular hardware component engineered to distribute highly stable DC/DC power directly to critical controller backplanes and I/O communication cards within DeltaV Distributed Control Systems.

Hardware Specifications

Process Control & Power Interfacing

The VE5135 streamlines cabinets by integrating power routing directly into the DeltaV system structure.

• Integrated Power Buses: Utilizes internal power bus connections on the carrier backplane. This plug-and-play design eliminates external hookup wires, minimizing points of failure.
• Decoupled Active Load-Sharing: Implements built-in load-sharing circuitry, allowing redundant pairs to run in parallel. If one unit fails, the secondary supply carries the load with zero transition lag.
• G3 Environmental Resilience: High-grade conformal coating shields the surface-mount technology (SMT) circuitry against airborne moisture, conductive carbon dust, and sulfurous corrosive gases.

Frequently Asked Questions

Q: How does the load-sharing capability protect my configuration?

A: When two VE5135 modules are installed in redundant slots on a DeltaV carrier, they actively share the electrical load. If one module loses input power or suffers a hardware fault, the other instantly absorbs 100% of the demand without causing a reboot of the controller or the offline state of connected I/O.

Q: Can I use this module on standard, non-proprietary DIN rails?

A: No, the VE5135 is designed specifically to slide directly into the power slots of standard DeltaV power/controller carriers, which themselves mount onto standard T-type DIN rails.

Field Installation Guidelines

• Module Placement: Insert the module firmly into its slot on the power/controller carrier until the top and bottom latching mechanism clicks securely into place.
• Carrier Ground Connection: Ensure that the T-type DIN rail on which the carrier is mounted is solidly connected to the enclosure's main master ground bus bar via low-impedance copper grounding wire.
• Airflow and Convection: Keep top and bottom ventilation openings on the module housing clear of obstructions to maintain ideal convective heat transfer.