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The Emerson KL2001X1-BD1, also cataloged as the KL2001X1-BD1 Ethernet I/O Card, operates as a dedicated hardware component for industrial Ethernet protocol translation and process device data integration within Emerson DeltaV DCS platforms.
| Parameter | Specification |
|---|---|
| Model | KL2001X1-BD1 |
| Brand | Emerson |
| Origin | USA |
| Weight | 0.50 kg |
| Dimensions | Standard DeltaV S-Series Carrier Card Dimensions |
| Operating Temp | -40 to 70 deg C |
| Power Consumption | 24 VDC @ 325 mA (7.8 W) |
| Shock Resistance | 10 g half-sine wave for 11 ms |
| Vibration Resistance | 1 mm peak-to-peak (2 to 13.2 Hz), 0.7 g (13.2 to 150 Hz) |
| Airborne Contaminants | ISA-S71.04-1985 Airborne Contaminants Class G3 |
| Relative Humidity | 5 to 95% Non-Condensing |
Designed for high-density Ethernet communications, the KL2001X1-BD1 acts as an interface bridge between field-level Ethernet devices and the core DeltaV system backplane. The module provides channel-to-channel isolation and galvanic line protection to isolate incoming Ethernet data streams from ground potential loops and electromagnetic transients. Integrated conformal coating rated to ISA-S71.04 Class G3 ensures robust protection against corrosive airborne gases, preserving internal circuit traces when routing 4-20 mA HART over IP or industrial bus protocols.
Q: Does the KL2001X1-BD1 support Removal and Insertion Under Power (RIUP) on live DeltaV system carriers?
A: Yes, the card supports hot-swapping on energized carriers without causing system backplane bus trips or disrupting signal communications on adjacent I/O slots.
Q: What power parameters are required to run the module, and how does it manage thermal dissipation?
A: The card draws 325 mA at 24 VDC (7.8 W max) directly from the carrier backplane power rail. Thermal dissipation relies on natural cabinet convection across its operating range of -40 to 70 deg C.

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