ABB DSRC 112 52820083-GD Industrial Cabinet Cooling Fan Unit

Product Description

The DSRC 112 (52820083-GD) is a rugged, rack-mountable Enclosure Fan Unit manufactured by ABB to provide active forced-air thermal regulation inside Advant Master DCS and MasterPiece control cabinets. Operating on a standard 24V DC electrical architecture, this ventilation assembly is vital for extracting concentrated thermal loads generated by high-density processing racks, protecting sensitive central processors and I/O cards from heat-induced degradation. 

Technical Specifications

• Manufacturer: ABB

• Product Line / System: Advant Master DCS / MasterPiece Cabinets

• Model Identification: DSRC 112 (Cross-compatible with DSRC 113 engineering profiles)

• ABB Part Number / Product ID: 52820083-GD

• Device Classification: Central_Unit / Forced-Air Cooling Tray Assembly

• Operating Input Voltage: 24 V DC nominal

• Internal Component Breakdown:

• 1 x Base Frame Chassis (DSRC 001 / Part No. 52820090-A)

• 3 x High-Velocity Cooling Fans (Part No. 6480096-9)

• 1 x Dedicated Circuit Protection Fuse (Part No. 56722011-17)

• 1 x Optional Air Filter Mat (Part No. 3BSC930057R1 - sold separately)

• Harmonized System Code (HS Code): 841459 (Mechanical Fans & Ventilating Hoods)

• Customs Tariff Designation: 84145915

• WEEE Disposal Category: 5. Small Equipment (No external dimension greater than 50 cm)

• Onboard Battery Backups: 0

• Environmental Standards Compliance: Following EU Directive 2011/65/EU (RoHS Compliant)

• Product Net Weight: 2.80 Kg

• Product Dimensions (W x H x D): 189 mm x 9 mm x 432 mm

Industrial Application Scenarios

The DSRC 112 (52820083-GD) cooling tray is installed directly inside sealed mainframe panels, termination cubicles, and system expansion racks housing active processors or high-density field interface modules. Because process industries—such as chemical plants, water distribution stations, and pulp mills—run non-stop, internal cabinet temperatures can escalate rapidly. This module drives continuous air displacement across internal card cages, preventing localized hot spots that disrupt processing algorithms, accelerate electronic aging, or cause unwanted emergency shutdowns.